CUTMASTER

Laser & Beam Delivery

• Micrometer adjustable or programmable focus
• Completely sealed to eliminate contamination
• Quick change focusing lenses to accommodate multiple processing
• Gas assist

DRILLMASTER

Laser & Beam Delivery

• Laser & Beam Delivery
• Micrometer adjustable or programmable beam delivery system
• Completely sealed to eliminate contamination
• Quick change focusing lenses to accommodate multiple processing
• Standard gas assist
• Standard camera system viewing system for part alignment

DRS X Series

Laser & Beam Delivery

• Enhanced quality image plane objectives
• Automatic edge lock accuracies better than 50 nm
• Imaging features less than .2 microns Cutting line widths less than .1 micron
• Programmable object turret with multiple objectives for processing and navigation on photomask
• Auto-focus sets focus to within .2 microns even on MOSI masks
• Deposition Mode

F/A LIT

Layer by Layer Decap

Decapsulation is a process that most failure analysis labs use on a routine basis. The F/A uses our patent pending laser technology to allow an operator to remove individual layers of the mold compound all the way through the lead frames to the substrate. The F/A Decap process is 100% controllable by the operator through a Graphic User Interface (GUI). The operator can remove the entire compound, individual layers (operator determines layer thickness) or sections of the mold compound (operator defined). This controllable process allows the device to go directly into many other testing procedures such as wire pull or even electrical test in some cases. The F/A can import images from a variety of testing processes such as C-SAM, SEM, SAM and even X-RAY to show the operator exactly where the area of concern is within the sample. The F/A also eliminates the need for costly, dangerous, and hazardous chemicals with the comfort of knowing the process is safe and accurate.

TASKMASTER

Laser & Beam Delivery

• Cutting
• Trimming
• Scribing
• Ablation
• Drilling
• Welding

WELDMASTER

Laser & Beam Delivery

• Micrometer adjustable or programmable beam delivery optics
• Completely sealed to eliminate contamination
• Quick change focusing lenses to accommodate multiple processing
• Standard programmable gas assist Standard camera system,
• B/W monitor, cross hair generator, and processs viewing for part alignment
• Optional vision system and image recognition for part alignment or hole inspection

WIREMASTER

Mechanical, thermal and chemical wire stripping processes cause damage to underlying wire that can affect electrical component performance and cause unacceptable conductor failures for aerospace, defense, medical, automotive, and other industrial companies using mission critical electronics. Manufacturers of these devices need to be aware that laser wire stripping technology is available that will guarantee the elimination of these problems. Applying CO2 laser light (10.6 microns wavelength) vaporizes wire insulation while being incapable of affecting the conductive wires. This wavelength of laser light is absorbed by the wire insulation and completely reflected by metal wire conductors. This technology eliminates the need for replacement blades and hazardous chemicals. Using lasers to strip wire yields the highest quality insulation and adhesive removal while delivering the absolute best quality and most precise wire stripping available.

Lasers can remove wire insulation from a wide variety of wire types including single core, multiple leads, twisted pairs, multi-cable, coaxial cable, and many others. Wires with diameters as low as 0.001 inches can be safely stripped. Tolerances for the laser can be held as tight as 0.001 inches. Single strand wires can be stripped in less than 1 second.

Virtually all wire insulation types can be removed using this laser technology. Wires are easily slit using this same CO2 laser. Straight, T-strip, Window slits, as well as, Spiral strips can be programmed to a controlled depth.

Our non-contact process yields the most flexible, highest quality, and most reliable laser stripping and slitting available. This laser technology will meet the toughest conductor damage requirements of the FAA, NASA, and the DoD.