Simple to use, these natural convection ovens offer the most economical approach to basic thermal processing applications.

Forced convection and a "uniflow" air circulation pattern provide excellent temperature uniformity.

A top mounted heater improves reliability in applications where spills are possible.

The LBB series has replaced the LDB series.

Bi-parting doors front and back allow product to be loaded on one side of the oven and unloaded on the other for more efficient work cell arrangements.

Forced convection and "uniflow" air circulation pattern provide excellent temperature uniformity.

A combination of forced convection and horizontal airflow provides exceptional temperature uniformity and the shortest possible processing time.

Features a 3-in-one programmable controller.

Designed for oxygen-sensitive products that require inert atmospheres, these ovens feature horizontal airflow for exceptional temperature uniformity.

Features a 3-in-one programmable controller.

Non-HEPA filtered clean room oven is designed to save valuable floor space & provide maximum ergonomic efficiency for operators. Perfect for die-bond curing and other semiconductor packaging processes. Features SEMI S2 and CE compliance, programmable controller, air or inert atmosphere. Silicone free models available.

For production environment processes where minimal contamination is essential, the LCC and LCD Series ovens offer the highest standards in HEPA filtration.

Re-circulated airflow is 100% HEPA filtered for operation at ISO Class 5 (Class 100) or better within the oven chamber. Silicone free models available.

These ovens are designed specifically for dynamic and static burn-in of integrated circuits and other electronic devices.

They are available in either air or nitrogen atmosphere configurations.

Despatch’s stackable burn-in chambers offer maximum flexibility for small lot qualification testing, burn-in, reliability testing, and research and development.

900 Series Benchtop Temperature Chambers

These chambers are ideal for small lot qualification, burn-in, and life testing of semiconductor devices under a wide range of high and extremely low temperature conditions. They can be cooled by either liquid nitrogen or liquid carbon dioxide.

Designed for accelerated life cycle testing of semiconductor and electronic devices. Single load or double load capacity allows all tested devices to undergo the same temperature cycle conditions, cycle after cycle. Uniform horizontal airflow insures proper heat transfer, excellent thermal gradient, and the rapid temperature recovery rates critical for maximum throughput and proper test performance. Performs to MIL STD 883C and JESD22

This vertical down airflow, HEPA filtered, continuous oven utilizes a pressurized air distribution plenum to supply superior outlet air uniformity.

These ovens are designed with a high-volume, vertical down airflow for process versatility and reliability.

These ovens are designed with a high-volume, vertical down airflow for process versatility and reliability.

CT-150 and CT-200 Polyimide Curing Tool
The CT-150 and CT-200 Polyimide Curing Tools provide a unique "chamber in a chamber" design that reduces particulate contamination and oxygen concentration. Despatch's Polyimide Curing Tools deliver industry-leading performance in temperature uniformity for improved yield in electronic packaging applications, including both device-level packaging and wafer level packaging.