Hybrid Technologies

An advanced new platform ideal for trim and test of thick film components and circuits, including PCBs, SMT components and hybrids. Versatility to address our widest range of trim and micro-machining applications.

• Fully integrated test functions for fast and accurate measurement.
  Patented beam calibration and powerful vision system for precise, efficient beam positioning.
• ErsiTrim™ software for easy application programming and automation integration.
• XI architecture with GPIB and other interfaces for custom instrumentation.
• Advanced diode-pumped laser processing in IR or green wavelengths for demanding applications.

An advanced new platform ideal for trim and test of thin film resistors, resistor networks, and other thin film applications.

• Versatility to address our widest range of thin film trimming and micro-machining applications.
• Positioning accuracy and small spot sizes for ultra-fine geometries.
• Patented beam calibration and powerful vision system for precise, efficient beam positioning. Exclusive “Adaptive Trim Control” provides statistical information and intelligent recommendations to compensate for process variations.
• Open-architecture VXI, GPIB and custom instrumentation supports passive and functional circuit adjustment. Advanced diode-pumped laser processing in IR or green wavelengths for demanding applications.

Semiconductor

An advanced new platform for high precision, high throughput wafer-level optimization of linear and mixed-signal IC devices

• Next generation version of out field-proven M310 WaferTrim technology.
• Fully integrated state-of-the-art Laser Trimmer and Wafer Prober System.
• Seamless integration to today's ATEs via GSI Group's Enchanced Tester Interface software and real-time tester interface hardware.
• Proven superior laser control ensures process consistency & highest yields.
• Advanced vision and motion subsystems provide dramatically improved positioning and alignment capability.
• A new user friendly WaferTrim™ software improves efficiency & provides compatibility with existing M310 data setup file.

“Total solution” system technology to process extremely tight-pitch fuse structures for exceptional yield enhancement on semiconductor devices, including 90nm and 70nm technology.

• High-yield process control capability: ultra stable, ultra-fine energy setting for accuracy, range, and resolution – a critical laser redundancy process requirement for today’s and the next generation of ultra fine pitch links.
• Patented highspeed positioning system optimizes throughput and enables a 70,000 links/sec processing rate.
• Precise <0.150µm (|mean| + 3σ) system accuracy.
• Minimum laser spot size of 1.4µm.

WaferMark series laser systems from GSI Group are the recognized industry leaders for wafer marking applications. We have WaferMark solutions for the two most important reasons why you mark wafers and die — traceability and product identification. Patented SuperSoftMark® for debris-free marking.

• Class 1 clean room compatibility. Ultra-stable, patented diode pumped laser.
• Optional SECS II/GEM interface for factory communication/networking.
• No external cooling require.

Test & Measurement

A new level of speed, accuracy, and flexibility for 100% in-line
inspection in a reliable, affordable package. Industry leading direct laser inspection technology for high accuracy 3-D measurements.

• Paste height, area & volume measurements with Gage R&R <10%.
• Versatility to perform solder paste and component placement inspection.
• Unsurpassed flexibility for off- and on-line inspection program set-up and modification.
• Fully capable of inspecting CSPs, 0201s, or smaller geometries.
• Inspects panels from 5.1cm x 7.6cm up to 50.8cm x 61.0cm.
• Easy line integration, set up, and use.